DGP8761 | Polishers | Product Information | DISCO CORPORATION
The DGP8761 is compatible with grinding wheels, polishing wheels, dresser boards and other parts designed for existing DISCO 8000 Series equipment. In addition, the operation method …
2024 | News | DISCO CORPORATION
Dec 10, 2024 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …
DISCO Corporate History
Since DISCO had transformed itself from a small abrasives shop to a leading manufacturer of precision processing tools and equipment and because the character of the company had …
DISCO CORPORATION
DISCO Technical Review 有关 Kiru（切）・Kezuru（削）・Migaku（磨）技术的见解和论文。
DISCO CORPORATION
DISCO Technical Review 與Kiru（切）・Kezuru（削）・Migaku（磨）技術相關的見解‧論文之頁面。
KABRA｜DISCO CORPORATION
This is an ingot slicing method where a separation layer (KABRA layer) is formed at a specified depth by continuously irradiating an ingot with a laser, producing wafers starting from the …
2023 | News | DISCO CORPORATION
Dec 12, 2023 · DISCO is a semiconductor equipment manufacturer that provides precision processing equipment, including dicing saws and grinders, and precision processing tools …
DISCO CORPORATION 产品・技术信息
User Agreement Use of the DISCO Corporate Name Guarantee policy for customer using DISCO Products 关于工艺对应方针 关于由第三方对本公司刀片进行再生处理的声明事项 关于由第三方 …
DFL7161 | Laser Saws | Product Information | DISCO CORPORATION
DFL7161 is a fully automatic laser saw for Φ300 mm wafers which has already seen wide use. It performs a series of processes from HogoMax * coating and dicing to automatic cleaning. The …
会社情報 | 株式会社ディスコ - DISCO
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