Semiconductor Engineering18h
Critical Design Considerations For High-Bandwidth Chiplet Interconnects (TSMC)
Bandwidth Chiplet Interconnects for Advanced Packaging Technologies in AI/ML Applications: Challenges and Solutions” was ...
Semiconductor Engineering18h
Pooling CPU Memory for LLM Inference With Lower Latency and Higher Throughput (UC Berkeley)
Pooling CPU Memory for LLM Inference” was published by researchers at UC Berkeley. Abstract “The rapid growth of LLMs has ...
Semiconductor Engineering19h
Aging, Complexity, And AI In Analog Design
Where digital and analog designs are overlapping, and why it's becoming more difficult to ensure they work as expected over ...