The growing amount of electronics within modern vehicles has made the inspection process for wire bonds increasingly challenging, as active devices shrink and bonds are arranged in complex ways.

New generations of small medical electronics devices demand the highest levels of quality and reliability For EMS providers and contract manufacturers, the International Standards Organization (ISO) ...

NEOTech, a leading provider of electronic manufacturing services (EMS), design engineering, and supply chain solutions in the high-tech industrial, medical device, and aerospace/defense markets, is ...

Microelectronics has solved the challenge of packaging different functional elements with integrated chips (ICs) in modern computing and communication by wire bonding. Miniaturization was a trend ...

MACOM’s first product using the AlGaAs hot via process technology is the MASW-011261 , a broadband SP2T switch operating from 60 to 110 GHz. It delivers typical insertion loss of 0.9 dB, 30 dB ...

Three-dimensional (3D) nano-printing of freeform optical waveguides, also referred to as photonic wire bonding, allows for efficient coupling between photonic chips and can greatly simplify optical ...

A new technical paper titled “ILP-Based Substrate Routing with Mismatched Via Dimension Consideration for Wire-bonding FBGA Package Design” was written by researchers at National Taiwan University of ...