The global SiC Wafer Processing market size is projected to reach US$ 2,986.44 million by 2032, at a CAGR of 14.43% ...

New York, Feb. 21, 2020 (GLOBE NEWSWIRE) -- Reportlinker.com announces the release of the report "Thin Wafer Processing and Dicing Equipment Market - Growth, Trends ...

(MENAFN- EIN Presswire) Rest of Asia-Pacific segment contributed the major share in the thin wafer processing and dicing equipment market in 2021. The thin wafer processing and dicing equipment market ...

The inevitable move to one-at-a-time wafer processing, expected to come about in the 300mm-wafer generation, is almost certain to have a dramatic impact on the manufacturing supply chain, according to ...

X-Fab Semiconductor Foundries today announced it has expanded its product line, entering the silicon on insulator (SOI) wafer processing arena. The Erfurt, Germany-based mixed-signal foundry has ...

Scientists in China have investigated the fracture strength of commercial G12 monocrystalline wafers via the 4-point bending test and have found that wafer thickness, the position of the silicon wafer ...

TORONTO, Aug. 12, 2025 /PRNewswire/ - Xanadu, the leading photonic quantum computing company, and DISCO Corporation, renowned precision machine and processing tool manufacturer, are developing ...

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Chip startup Graphcore Ltd. today introduced a new artificial intelligence processor, the Bow IPU, that uses an innovation dubbed wafer-on-wafer technology to speed up calculations. U.K.-based ...

Cerebras Systems and the federal Department of Energy’s National Energy Technology Laboratory today announced that the company’s CS-1 system is more than 10,000 times faster than a graphics processing ...

Modern semiconductor fabrication involves aligning silicon wafers and photolithography masks to nanometre precision. As the industry shifts from using 200 mm diameter wafers to 300 mm wafers, ...