The Global Electronics Association has published a new international standard, IPC‑6921, for organic IC substrates.

Atomic force microscopy (AFM) shows the surface of the TaC thin film before and after annealing at high temperatures. The initial film surface is composed of many columnar grains, whereas after ...

Interposers and substrates are undergoing a profound transformation from intermediaries to engineered platforms responsible for power distribution, thermal management, high-density interconnects, and ...

Nippon Electric Glass Co. has embarked on developing an innovative glass core substrate compatible with CO2 laser processing, aiming to enhance the efficiency of manufacturing next-generation ...

Perovskite lasers have rapidly achieved progress in developing continuous-wave excited lasing from a femtosecond pulse excited lasing, which is considered a critical step towards electrically excited ...

As the strip being inspected that day passed through the scanning device, 132 square boxes appeared on the monitor, each filled with green (normal) or red (defective) lights. The time taken to inspect ...

Mersen is a global expert in electrical specialties and advanced materials for high-tech industries. With more than 50 industrial sites and 16 R&D centers in 35 countries around the world, Mersen ...

The chip industry is racing to develop glass for advanced packaging, setting the stage for one of the biggest shifts in chip materials in decades — and one that will introduce a broad new set of ...

ECISTM (Electric Cell-Substrate Impedance Sensing) is the only commercially available technology which continuously monitors TEER under dynamic flow conditions. In their natural environment, ...