Three independent design processes – chip, package, and PCB – are typically required for the latest electronic products which utilize increasingly complex systems on chip (SoCs) and multiple chips in ...

This application note focuses on printed circuit board (PCB) layout considerations for QFN and DQFN packages. This is intended for users who are familiar with PCB design, as well as, signal integrity ...

Mentor Graphics is bringing together the IC design, package design and PCB layout in a single tool environment. The design environment called Xpedition Package Integrator flow can be used to integrate ...

Looking to address a range of PCB design challenges, including growing complexity, Mentor Graphics has announced the first phase of a new systems design enterprise platform. Called Xpedition – and ...

Mentor, a Siemens business, is into a wide range of software, from real-time operating systems (RTOSs) to chip-design tools. Also in the mix is printed-circuit-board (PCB) design software. Quite a bit ...

6. SOT-23 and SOIC packages are typically used in low-power motor drivers. Standard leaded packages, like SOIC and SOT-23 packages, are often used for low-power motor drivers (Fig. 6). To maximize the ...

Thermal and mechanical stresses are creating significant challenges in heterogeneous chiplet assemblies, increasing the time and cost required to work through all the possible physical effects, ...

Nvidia's introduction of the GeForce RTX 5090 Founders Edition marks a significant step in GPU engineering with its uniquely compact and power-intensive printed circuit board (PCB) design. The RTX ...