The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...
Editor’s Note: This “How it Was” story is told by Aubrey Kagan, who is a professional engineer with a BSEE from the Technion-Israel Institute of Technology and an MBA from the University of the ...
High efficiency, high density and low production costs drive the continual development of DC/DC converters for an increasingly wide range of power supply applications for automotive, industrial, ...
With the significant reduction in package parasitics provided by the eGaN FET, the package inductance is minimized and is no longer the major parasitic loss contributor. The high frequency loop ...
This file type includes high resolution graphics and schematics when applicable. In the development of SoC-based (system-on-chip) circuit boards, the SoC’s additional capabilities will provide ...
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