A new manufacturing process uses lasers to seal paper packaging instead of glue

The Papure project turns existing paper compounds into a natural adhesive, creating highly recyclable packaging. is a senior ...
New Atlas

Lasers used to seal paper – no adhesives or plastics required

In the packaging war between paper and plastic, plastic has remained indispensable – even in paper products – through one vital aspect: sealing. Until now, reliable paper seals have required adhesives ...
Business Wire

Zume Partners with Solenis to Open Up PFA-Free Molded Fiber Packaging and Manufacturing Playbook to Global Food and CPG Brands

CAMARILLO, Calif.--(BUSINESS WIRE)--Zume, the sustainability solutions company creating economically viable substitutes for single-use plastics, today announced a partnership with Solenis, a leading ...
Semiconductor Engineering

Packaging With Fewer People And Better Results

Advanced packaging has evolved far beyond the simple stacking of dies and connecting of interposers. Once a passive conduit between silicon and the outside world, it has become an active component of ...
Drinks

Mondelez International gets grant for method of manufacturing comestibles with packaging material application

Mondelez International has been granted a patent for a method of manufacturing comestibles. The process involves shaping a comestible mass into a desired structure using a forming station and then ...
Design-Reuse

IC Manufacturing and Packaging: The Engine Powering the Digital and AI World

The modern world runs on integrated circuits (ICs). From smartphones and cars to AI data centers, medical equipment, satellites, and industrial automation systems, semiconductor chips are the ...
Taiwan News

Foundry 2.0 expansion boosts Taiwan’s chip packaging industry

TAIPEI (Taiwan News) — Demand for artificial intelligence chips is accelerating growth across the semiconductor industry, ...
The Cincinnati Enquirer

ELIS Manufacturing and Packaging Solutions Highlights Expanded Stick Pack Manufacturing Capabilities

ELIS Manufacturing and Packaging Solutions Inc. announced continued investment in and refinement of its stick pack manufacturing and packaging capabilities, reinforcing the company’s role in ...
csis.org

Advanced Packaging and the Future of Moore’s Law

Fundamental to all digital technologies, semiconductor chips are a major focal point in twenty-first-century geoeconomic competition. Nations see it as an imperative to invest heavily in semiconductor ...
Forbes

Why Should You Automate Manufacturing Processes: To Save Money, Make Money Or Both?

No matter what they churn out at the end of the line, manufacturers are always searching for ways to lower costs and accelerate production without sacrificing quality. It all comes down to automation ...
Digi Times

India roundup: India's OSATs are comfortable with materials today, but that may not last

India's backend semiconductor makers see temporary relief from material constraints linked to legacy packaging, as KLA opens a US$36 million R&D hub in Chennai to boost AI, software, and process ...