This higher density of circuitry on a wafer requires greater accuracy and a highly fragile and advanced fabrication process. Several newer and highly complex ICs today are made of a dozen or more ...
In this article, the most common errors occurring at different stages of the semiconductor fabrication process and the strategies to mitigate them are discussed. The ever-growing complexity of the ...
Semiconductor devices are ubiquitous in our everyday lives and foundational to today’s communication, education, manufacturing, health, and transportation industries. From the moment our phone’s alarm ...
A new semiconductor manufacturing process is said to make possible ICs with submicron geometry that can withstand as much as 30 V. Dubbed industrial CMOS (iCMOS) by its creators at Analog Devices Inc.
The manufacture of automotive ICs will continue to rely mainly on mature process technologies, according to Denise Lee, senior consultant at McKinsey. Speaking at a forum during the ongoing SEMICON ...
The supply of handset-use power management ICs remains severely tight, prompting the chip suppliers to transition to 12-inch wafer manufacturing, according to industry sources. PWM IC suppliers ...
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