The European Mask and Lithography Conference (EMLC) 2024 recently was held in Grenoble, France, and had about 190 participants from a wide range of companies and institutions. Being relatively new to ...

At the heart of advancing semiconductor chip technology lies a critical challenge: creating smaller, more efficient electronic components. This challenge is particularly evident in the field of ...

Concept of mask/wafer co-optimization by moving the shot with mask and wafer double simulation to minimize wafer error. VSB shot configurations and its corresponding ...

In a breakthrough set to revolutionize the semiconductor industry, the School of Engineering of the Hong Kong University of ...

Extreme ultraviolet lithography (EUVL) has emerged as a cornerstone technology in the semiconductor industry, enabling the production of devices with sub-10 nm feature sizes. By utilising a 13.5 nm ...

The eBeam initiative celebrated its 15 th anniversary at the recent SPIE Advanced Lithography + Patterning Conference. 130 members of the mask and lithography community attended the annual lunch to ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has begun development of a photomask manufacturing for 2-nanometer (10-9 meter) generation logic semiconductors that support ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP) (TOKYO: 7912) has successfully developed a photomask manufacturing process capable of accommodating the 3-nanometer (10-9 meter) lithography ...

For IC design at the 90- and 65-nm process nodes to be truly successful, the design process needs more predictability built into it in terms of yield. The problem, to a large extent, is that there has ...

In a breakthrough set to revolutionize the semiconductor industry, engineers have developed the world's first-of-its-kind deep-ultraviolet (UVC) microLED display array for lithography machines. This ...