The Chip Technology That Finally Gives Intel an Edge Over TSMC

Intel was first to market with backside power delivery.
EDN

Understanding Factors Affecting Intel QuickPath Interconnect Signal Integrity (Part 2 of 2)

The Intel® QuickPath Interconnect operates at extremely high frequencies, so it is essential that circuit designers understand the many factors that affect differential signal integrity. This article ...
FMIBlog

Chiplet Architectures and Advanced Packaging Redefine the U.S. Semiconductor Assembly and Testing Industry

U.S. semiconductor companies were among the first to respond by disaggregating large chips into smaller, specialized chiplets ...
EDN

Time Domain Modeling and Simulation of Intel QuickPath Interconnect Circuits (Part 2 of 3)

The Intel® QuickPath Interconnect operates at extremely high frequencies, so it is essential that circuit designers understand the many factors that affect differential signal integrity. This ...