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Intel details new advanced packaging breakthroughs — EMIB-T paves the way for HBM4 and increased UCIe bandwidth
Intel disclosed several chip packaging breakthroughs at the Electronic Components Technology Conference (ECTC), outlining the technical merits of multiple new chip packaging techniques. We spoke with ...
Intel yesterday opened its Fab 9 advanced chip factory, pictured here, in Rio Rancho, NM, part of Intel’s previously announced $3.5 billion investment in its New Mexico operations for manufacturing ...
TL;DR: Intel CEO Pat Gelsinger stated that the use of on-package memory with Lunar Lake CPUs was a one-time decision due to its impact on gross margins. Future CPUs, including Panther Lake and Nova ...
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