Ball grid arrays are the boon and bane of engineers and printed circuit board designers the world over. Their unparalleled pin density and low lead inductance are essential in today’s high pin count, ...

Electronic devices continue to shrink in size with advancement in chip fabrication technology. Packaging technology has responded with improved formats to present these chips for assembly to PCBs.

IC packaging is a technique for shielding semiconductor equipment from ambient physical damage or degradation by wrapping them in ceramics or polymer packaging materials. There are several varieties ...

While there are entire textbooks that cover the topic of BGAs, their use and fanout techniques, the quick overview provided here offers an engineer a good starting point for improving BGA designs. BGA ...