Amkor Technology Inc. today unveiled a high-density manufacturing process that it claims changes the way leadframe-based ICs are packaged and assembled. The Chandler, Ariz.-based company’s (nasdaq: ...
Westford, USA, Feb. 20, 2023 (GLOBE NEWSWIRE) -- It is anticipated that the Asia-Pacific region will control more than 90% of the IC packaging market. The existence of important IC packaging and ...
Ottawa, Oct. 22, 2024 (GLOBE NEWSWIRE) -- The global semiconductor & IC packaging materials market size is predicted to increase from USD 48.54 billion in 2025 to approximately USD 113.29 billion by ...
Amid the COVID-19 crisis, the global 3D IC and 2.5D IC Packaging Market estimated at USD 86.8 Billion in the year 2020, is projected to reach a revised size of USD 730 Billion by 2027, growing at a ...
At the recent IEEE Electronic Components and Technology Conference (ECTC) in Las Vegas, a number of packaging houses, R&D organizations and universities presented a slew of papers on the latest IC ...
Despite a year of lackluster growth, wireless communications customers are still in the driver's seat when it comes to pushing for advanced packaging technologies that play into their requirements for ...
Leading integrated circuit (IC) foundries are already shipping 7-nm and 5-nm wafers and 3-nm product qualifications are ongoing. Wafer costs continue to soar as high transistor density requires ever ...
2.5D IC packaging technology is expected to account for the largest share of the 3D IC and 2.5D IC packaging market during the forecast period. A 2.5D silicon interposer is a silicon or glass ...
Innolux will remodel a 3.5G LCD panel factory to house an IC packaging line, with production to begin in second-half 2023, according to company president James Yang. Innolux has been developing FO-PLP ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results