3D-ICs are proving a challenge even for designers accustomed to dealing with power and performance tradeoffs, but they are considered an inevitable migration path for leading-edge designs due to the ...

Multi-die assemblies are becoming more common and more complex due to technology advancements and market demands, but differing die dimensions are making this process increasingly challenging. To ...

To navigate potential US sanctions on China’s chip industry, Chinese semiconductor design companies are forging collaborations with Malaysian chip packaging firms for the assembly of high-end graphics ...

As the global chip war between China and the US reaches a fever pitch, a quiet giant is emerging to take the spotlight. Malaysia, once a humble player in the semiconductor industry, has pivoted from ...

The government confirmed on the 28th that the Honam region’s semiconductor materials, parts, and equipment (MP&E) infrastructure is the most vulnerable nationwide. The “MP&E ecosystem” is considered ...