SK hynix has launched iHBM, an architecture featuring a Dynamic Random Access Memory (DRAM) ...

Through the iHBM solution, slated for deployment in next-generation HBM products including HBM5, SK hynix aims to increase the stability and operational efficiency of HPCs, AI data centers by meeting ...

Samsung HBM5 made its public debut at Computex 2026 with a new Heat Path Block thermal architecture and a 2nm base die plan — ...

SK Hynix claims a 30% reduction in thermal resistance for its new chip design integrating cooling inside HBM memory stacks.

SK hynix HBM cooling takes a new form: the South Korean chipmaker embeds silicon-based elements directly inside the HBM ...

Amid the artificial intelligence (AI) boom, a game changer has emerged to address the biggest challenge in semiconductor high ...

SK hynix has unveiled a new high-bandwidth memory technology integrating cooling functions directly into the package, aiming ...

SEOUL, South Korea, April 18, 2024 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today that it has recently signed a memorandum of understanding with TSMC for ...

The end of the year is typically thin on interesting news in the technology sector, as companies opt to wait for the Consumer Electronics Show (CES) in January to make any major announcements or ...

For graphics, networking, and high performance computing, the latest iteration of high-bandwidth memory (HBM) continues to rise up as a viable contender against conventional DDR, GDDR designs, and ...

SEOUL, South Korea, May 25, 2026 /PRNewswire/ -- SK hynix Inc. (or "the company", www.skhynix.com) announced today the launch of the iHBM solution that embeds ...