Glass substrates help overcome limitations of organic materials by enabling an order of magnitude improvement in design rules needed for future data centers and AI products. SANTA CLARA, ...

The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping, which ...

Together with partners, the SCHMID Advanced Integrated Circuit (IC) Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass ...

Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030. Save my User ID and Password Some subscribers prefer to save ...

LAS VEGAS, NV, UNITED STATES, January 20, 2026 /EINPresswire.com/ — CIT (CEO Seung Jeong) announced its participation in CES 2026, the world’s largest IT and consumer electronics exhibition, held in ...

Intel Corporation INTC is set to revolutionize the industry with the ground-breaking launch of glass substrates for advanced packaging of chips. This industry-leading product is likely to be available ...

LG Innotek has entered the glass substrate business, which is regarded as a "game changer" in next-generation semiconductor packaging. The company ...

The development of glass-based substrates for electronics in datacentres and high-performance computing is the aim of a consortium gathered by German research institute Fraunhofer IZM (Fraunhofer ...

The big picture: Most expect that by the end of the decade, the semiconductor industry will hit a wall in terms of being able to scale transistors on silicon using organic materials. Scaling is key to ...

In addition to surface and subsurface defects, residual stress represents a concern. Over time, these stress points, ...

These days when we talk about what's next for chip design, we focus on things like cramming in more cores, increasing clock speeds, shrinking transistors and 3D stacking. We rarely think about the ...

Intel announced one of the industry's first glass substrates for next-generation advanced packaging, planned for the latter part of this decade. This breakthrough achievement will enable the continued ...