Conducting site-specific, cross-sectional failure analysis and fault isolation on complex, highly integrated packaged chips using FIB (focused ion beam) technology is no easy task. Analyzing 3-D IC ...
Silicon carbide (SiC) is a crystalline material utilized to develop a wide array of electronic devices, including transistors and other high-power, high-frequency, and high-temperature devices. As ...
It has been over 30 years since the first focused ion beam was used to make a TEM specimen. FEI, a company that is now part of Thermo Fisher Scientific, has been an essential part of helping take ion ...
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