“The demand for accurate information about the internal structure and characteristics of dynamic random-access memory (DRAM) has been on the rise. Recent studies have explored the structure and ...

What just happened? A Californian company is launching what it calls a ground-breaking solution for increasing DRAM chip density with 3D stacking technology. The new memory chips will greatly improve ...

On June 4, 1968, Robert Dennard was granted a patent for a single transistor, single capacitor DRAM cell design idea. This doesn’t sound earth-shattering today, but back in the sixties, this was a ...

Neo Semiconductor has announced the world’s first 3D stackable DRAM technology, called 3D X-DRAM, that could revolutionize computer memory. Neo estimates 3D X-DRAM can achieve 128Gb density with 230 ...

The global market for DRAM Wafer was valued at USD 12360 Million in the year 2024 and is projected to reach a revised size of USD 18560 Million by 2031, growing at a CAGR of 6.0% during the forecast ...

This article catches up on some recent announcements for memory technologies (DRAM) from Winbond, Samsung and Micron as well as Toshiba’s entry into the 22TB nearline HDD market. Bigger and more ...

The major memory makers have shifted their production toward memory used in AI data centers, such as high-bandwidth (HBM) and ...