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As integrated circuit (IC) designs continue to scale, the demand for efficient power management, performance optimization and reliable physical layout modification grows more critical. Meeting these ...

A recent trend confusing two quite different terms has had a huge negative impact on the yield, reliability, and manufacturability of DSM (deep-submicron) and subwavelength semiconductor designs. This ...

The right tool for the job makes all the difference. Ever try hammering a nail in with a rock? How many nails did you ruin before you gave up? Or try to tighten a crucial bolt by hand? It takes ...

The Ball Grid Array, or BGA package is no longer the exclusive preserve of large, complex chips on computer motherboards: today even simple microcontrollers are available with those little solder ...