We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, and when a new one comes out we’ve got a pretty good idea what ...
“More than Moore technologies can be supported by system-level diversification enabled by chiplet-based integrated systems within multichip modules (MCMs) and silicon interposer-based 2.5-D systems.
Tesla has been granted a patent for a multi-chip module design featuring a Redistribution Layer substrate with IC dies mounted on both surfaces, sockets, and a cold plate. The innovative mounting ...
Avnet Internix, a subsidiary of Avnet’s global Electronics Marketing group (Avnet EM) and ROHM Semiconductor (ROHM), a Japanese IC manufacturer have collaborated to jointly design and develop a power ...
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