BE Semiconductor (BESIY) Industries and Datacon Technology will merge to form a leading global advanced IC packaging system supplier, Silicon Semiconductor reports. Besi will take over all of ...
The Besi Datacon 8800 CHAMEO ultra plus is an advanced room temperature hybrid bonding system. It cost-effectively addresses increased demands for performance, speed, accuracy, and warpage control in ...
RADFELD, Austria--(BUSINESS WIRE)--Nov. 11, 2004--BE Semiconductor Industries N.V. (Besi), a well established manufacturer of assembly equipment for the semiconductor industry, and Datacon Technology ...
Results that may be inaccessible to you are currently showing.
Hide inaccessible results