If you were asked to design a camera sensor, you'd naturally put the photo receptors on top, closest to the light. Oddly enough, because of the way chips are fabricated, until recently most camera ...

Toshiba Electronics Europe has used back-side illumination (BSI) to realise image pixels with a pitch of 1.12 µm and to pack 8.08 million of them into a 0.25-in. (6.35 mm) sensor that can handle up to ...

Tokyo, Jan 23, 2012 – (JCN Newswire) – Sony Corp. today announced that it has developed a new next-generation back-illuminated CMOS image sensor which embodies the continuous evolution of the camera.

Taiwan's CMOS image sensor (CIS) supplier, Silicon Optronics (SOI), anticipates a double-digit revenue increase in 2024, buoyed by strong demand for high-level security surveillance and high-end ...

CMOS image sensor (CIS) supplier Silicon Optronics (SOI) has observed that customer inventory correction have gone on longer than anticipated in 2023 and plans to place a greater emphasis on backside ...

Flip-and-Lap in the fab moves image array to front of imager, which yields sharper, more sensitive pixels, but wafer bonding step adds cost. Tessera Technologies reports a conflict (and resolution) ...

SAN JOSE, Calif.--(BUSINESS WIRE)--BAE Systems, Inc. has unveiled its backside illuminated (BSI) “Hawkeye” HWK1411 ultra low-light image sensor, enabling market-leading night vision capabilities with ...