Leti, the next-generation chip stacking will be a key enabler for More-Than-Moore devices and applications, going forward ...
Peek inside the package of AMD’s or Nvidia’s most advanced AI products and you’ll find a familiar arrangement: The GPU is flanked on two sides by high-bandwidth memory (HBM), the most advanced memory ...
Activity around 3D heterogeneous integration (3DHI) is heating up, driven by growing support from governments, the need to add more features and compute elements into systems, and a widespread ...
Light field 3D display is an innovative glasses-free 3D display technology that provides a more accurate reconstruction of 3D information than 2D and traditional 3D displays. With its ability to ...
Using the developed electrodes, we demonstrated integral imaging based 3D imaging and display using a lens array to verify its performance. [Figure 2] Operating results of a 2D semiconductor ...
Complex manual steps in aircraft production – such as the assembly of newly developed, weight-reducing thermoplastic integral frames that stiffen the fuselage in the transverse direction – are to be ...
A new publication from Opto-Electronic Advances, 10.29026/oea.2023.220178 discusses integral imaging-based tabletop light field 3D display with large viewing angle. Light field 3D display is an ...
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